1. 2. 3. material content data sheet sales product name tle4208g issued 16. june 2015 ma# MA000916080 package pg-dso-28-43 weight* 834.61 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 11.786 1.41 1.41 14122 14122 leadframe inorganic material phosphorus 7723-14-0 0.073 0.01 87 non noble metal zinc 7440-66-6 0.292 0.04 350 non noble metal iron 7439-89-6 5.837 0.70 6994 non noble metal copper 7440-50-8 237.007 28.40 29.15 283974 291405 wire non noble metal copper 7440-50-8 0.406 0.05 0.05 487 487 encapsulation organic material carbon black 1333-86-4 1.136 0.14 1361 plastics epoxy resin - 52.241 6.26 62593 inorganic material silicondioxide 60676-86-0 514.459 61.62 68.02 616407 680361 leadfinish non noble metal tin 7440-31-5 4.913 0.59 0.59 5887 5887 plating noble metal silver 7440-22-4 1.897 0.23 0.23 2273 2273 glue plastics epoxy resin - 1.140 0.14 1366 noble metal silver 7440-22-4 3.421 0.41 0.55 4099 5465 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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